Core Summary

  • Micron Technology issued a press release on July 9 announcing that the first concrete has been poured at its $10 billion semiconductor campus in Clay, New York. The project involves three major U.S. contractors and marks the official start of construction for this large-scale initiative.
  • According to contractor Gilbane, this milestone signifies the project's transition from site preparation to vertical construction, ahead of schedule by more than one quarter. Jacobs and Bechtel are also involved in the project.
  • Micron, in partnership with Gilbane, has directed approximately $675 million to contractors, suppliers, and subcontractors in New York State to date, accounting for more than half of the total current contract awards (exact percentage not disclosed).

In-Depth Analysis

The first concrete pour occurred about one month after Micron selected Bechtel as the engineering, procurement, and construction (EPC) partner for the project's first phase. Gilbane has been responsible for pre-construction work since August 2025, when the Providence, Rhode Island-based contractor won the site preparation contract. Jacobs serves as the architectural and engineering design partner, according to Micron.

Once completed, the campus will become the largest semiconductor manufacturing site in U.S. history. According to Micron, the campus will consist of up to four wafer fabrication facilities and will support the company's goal of producing 40% of its DRAM (dynamic random access memory) output domestically in the United States.

"Today's milestone marks another significant step forward for Micron in Central New York, and what's even more remarkable is that we're here in July—months ahead of schedule—to pour the concrete foundation," said New York Governor Kathy Hochul in Micron's press release. "This is the largest private investment in New York State history."

Micron has also increased its planned U.S. investment from $200 billion to more than $250 billion by 2035, according to the company's press release. The New York campus is the cornerstone of this investment plan, but additional investments will also go to its site in Boise, Idaho. Micron expects its first Idaho fab to produce its first wafers by mid-2027, with the second fab coming online by the end of 2028.